JPH0621252Y2 - 半導体素子の取付装置 - Google Patents
半導体素子の取付装置Info
- Publication number
- JPH0621252Y2 JPH0621252Y2 JP15670388U JP15670388U JPH0621252Y2 JP H0621252 Y2 JPH0621252 Y2 JP H0621252Y2 JP 15670388 U JP15670388 U JP 15670388U JP 15670388 U JP15670388 U JP 15670388U JP H0621252 Y2 JPH0621252 Y2 JP H0621252Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- chassis
- locking
- flat portion
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 30
- 239000000463 material Substances 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670388U JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15670388U JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0276845U JPH0276845U (en]) | 1990-06-13 |
| JPH0621252Y2 true JPH0621252Y2 (ja) | 1994-06-01 |
Family
ID=31435480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15670388U Expired - Lifetime JPH0621252Y2 (ja) | 1988-12-02 | 1988-12-02 | 半導体素子の取付装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621252Y2 (en]) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1555692A2 (en) | 2003-12-25 | 2005-07-20 | Aisin Seiki Kabushiki Kaisha | Fixing device for electronic components |
| WO2021256810A1 (ko) * | 2020-06-15 | 2021-12-23 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 발전장치 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3790225B2 (ja) * | 2003-03-25 | 2006-06-28 | 東芝キヤリア株式会社 | 放熱装置 |
| WO2019139305A1 (ko) * | 2018-01-10 | 2019-07-18 | 엘지이노텍 주식회사 | 컨버터 |
| CN115513073B (zh) * | 2022-11-23 | 2023-03-07 | 季华实验室 | 一种功率器件散热结构及其装配方法 |
-
1988
- 1988-12-02 JP JP15670388U patent/JPH0621252Y2/ja not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1555692A2 (en) | 2003-12-25 | 2005-07-20 | Aisin Seiki Kabushiki Kaisha | Fixing device for electronic components |
| WO2021256810A1 (ko) * | 2020-06-15 | 2021-12-23 | 엘지이노텍 주식회사 | 열전모듈 및 이를 포함하는 발전장치 |
| JP2023530321A (ja) * | 2020-06-15 | 2023-07-14 | エルジー イノテック カンパニー リミテッド | 熱電モジュール及びこれを含む発電装置 |
| EP4167304A4 (en) * | 2020-06-15 | 2024-06-26 | LG Innotek Co., Ltd. | THERMOELECTRIC MODULE AND POWER GENERATION DEVICE THEREOF |
| US12336430B2 (en) | 2020-06-15 | 2025-06-17 | Lg Innotek Co., Ltd. | Thermoelectric module and power generation apparatus including the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0276845U (en]) | 1990-06-13 |
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